Advanced Engineering Solutions - Logo          Your Electronic Packaging Design and Manufacturing House - Image                                               Your Electronic Packaging Design and Manufacturing House
  • Electronic Packaging design
  • Drafting services
  • Design to cost
  • Engineering consulting
  • Manufacturing accompaniment and consulting
  • Standards consulting

Y&Y engineers have extensive experience in electronic packaging and various production technologies, e.g.:

  • Sheet-metal parts production (stamping, laser cutting, riveting and welding)
  • Extrusion
  • Machining
  • Plastic injection molding and vacuum forming
  • Metal parts die cast and sand or investment casting


Y&Y assists its clients in every step of the production process. Providing samples as well as mass-production services, while selecting the necessary technologies as well as the most suitable and cost-effective manufacturer in Israel and abroad.

  • CFD analysis including:
    • Natural and forced convection
    • Steady State and Transient
    • System, Board and Component Levels
  • Temperature and Air Velocity mapping
  • Thermal consulting





    Thermal mapping

  • Signal Integrity Simulations
  • Design to EMC
  • High Speed PCB design
  • Back Plane Design
  • Operation, Installation, Maintenance and System Manuals.
  • Flight Manuals.
  • Software User's Guides.
  • Software Development Documents (per MIL-STD 498)
  • Data Sheets.
  • Integrated Logistic Support (ILS)plans and documents.
  • Training Program Plans (TPP)
  • Frontal Classroom training and On-the-Job Training (OJT)
  • Components Data Base (AVL) – Building and maintenance.
  • Design support – optimal selection of components.
  • BOM analysis.
  • Components availability and optimization.
  • Library of symbols for ORCAD, Allegro schematic design– Building& maintenance.
  • RoHS review and update of component data base.

Comprehensive collection of components data for loading
into PDM systems synchronized with Design systems.

  • Technology analysis
  • System design consulting
  • Hardware and software design
  • Failure analysis
  • PCB & PCBA Process Definition
  • Special Packaging Technologies(MCM, Stacked technology and Smart Cards
  • Components and material selection
  • EMC regulatory approvals (EN, FCC and MIL-STD-461)
  • Environmental approvals (GR-63, ETS 300 019 and MIL-STD-810)
  • Safety regulatory approvals (IEC, EN & UL) - ITE, Industrial, Machinery and  Household appliances
  • NEBS (GR-63,  GR-1089 & TEEER) approvals projects management and support
  • Energy efficiency standards (ERP directive and Energy Star)
  • Radio and Telephony testing and approvals
  • Testing and standards approval support on the fields and Labs